FPC/FPCA-DSBJ

Your privacy is very important for us. When you visit our website, please agree to the use of all cookies. For more information about the processing of personal data, please go to Privacy Statement - Solutions - Product Finder Electronic Circuit Touch Display Precision Manufacturing Optical Module - Investor Relations - About Us - Join Us - Contact Us - Sustainability FPC/FPCA 单层和多层 Single Layer to Multi-Layer Flexible Printed Circuits (FPC) fabricated on Polyimide dielectrics with copper conductors • Adhesive and adhesive-less materials • Thin dielectric materials • Thin copper (5μm, 9μm, 12μm and up) • Static and dynamic bending • Signal integrity and high frequency • Via interconnects (micro/blind/buried) • HDI features • Single Sided FPC to Multilayer FPC Single Sided and Double Sided Assembly • FPC High Density Component Assembly • Solder attached chips (01005 and above) • TSOP, QFP, QFN, LCC, LGA, FBGA etc, solder attached • Fine pitch IC chip bonding with ACF • Bare die on flex attachment (gold ball bonding) • Unique component package attachment Module Level Assembly • Flex circuit assembly to plastic or metal frames & housings • Custom bending & forming • Specialized components • In-circuit and functional testing • LCD Modules, Camera Modules, Touch Modules and more Share this Page