Lontium Semiconductor’s Science and Innovation (R&ampD) Base Main Structure Successfully Topped Out_News_Company_Lontium

If you already have an account, please log in Lontium 2026-09-24 548 次 On the morning of September 22, the main structure of Lontium Semiconductor's Science and Innovation (R&D) Base was successfully topped out, with the final concrete pour completed. Mr. FENG CHEN, Chairman of the Board, was joined at the topping-out ceremony by representatives from the project's general contractor, design institute, supervision unit, and geotechnical investigation unit, as well as the company's core management team. The successful topping out marks not only a key phased milestone in the construction of Lontium Semiconductor's Science and Innovation (R&D) Base, but also a new stage in the company's development. As a key strategic initiative, the Science and Innovation (R&D) Base embodies the company's commitment to driving high-quality growth and empowering future development. Located in the Hefei Economic and Technological Development Zone in Anhui Province, the site covers 43.65 mu (approximately 29,100 square meters) with a total gross floor area of 93,700 square meters. The development comprises five buildings, including R&D and laboratory facilities and a conference center. Construction began on November 5, 2025. Since breaking ground, the project team has executed the construction in a well-organized and efficient manner. Main structure works for all five buildings were completed in parallel, reaching topping out in approximately 11 months as scheduled. Looking ahead, the project will move into the next phase, covering secondary structure works, mechanical and electrical (M&E) installation, and exterior facade and interior decoration. Overall completion and final acceptance are targeted for June 2027. Once completed, the project will comprehensively upgrade the company's R&D infrastructure, strengthening support capabilities for chip design, verification, and testing. It will provide an innovation platform for R&D breakthroughs and product iteration across intelligent vision, smart automotive, AR/VR, artificial intelligence, and high-performance computing. This will further reinforce the company's innovation capabilities and competitive edge. Since its founding, Lontium Semiconductor has focused on innovation and R&D in high-speed mixed-signal chip technology, while actively expanding its business and growing its team. With the company's rapid growth and scaling, the Science and Innovation (R&D) Base is a key strategic initiative. Looking ahead, Lontium Semiconductor will leverage this new R&D base to further strengthen its technology portfolio and product roadmap. The company will drive efficient commercialization of R&D results, deliver high-quality high-speed mixed-signal chip products to customers worldwide, and create long-term value for shareholders, customers, and society. Lontium will accelerate its progress toward becoming a world-class integrated circuit design company. Latest News 2026-09-01 "Future 20" 2026 Research Record: Lontium – From Behind the Screen to New High‑Speed Interconnection Scenarios 2025-12-01 Lontium Semiconductor Corporation Listed on "STAR Market Top 50 Value Companies" 2024-12-24 Lontium decided to setup an Automotive Component and System Solution Business Group 2024-10-15 Lontium upgrades its high performance MIPI receivers for AR/VR and AI applications 高速混合信号芯片设计的国家级高新技术企业 - R&D Center 0551-6811 4688 - Sales Center sales@lontium.com COPYRIGHT © 2026 Lontium shares All Rights Reserved. Anhui ICP Registration No. 19013500-1 Product Inquiry Should you have any requests or inquiries, please fill out the form below.